? semiconductor components industries, llc, 2006 february, 2006 ? rev. 8 1 publication order number: mc10h350/d mc10h350 pecl* to ttl translator (+5 vdc power supply only) description the mc10h350 is a member of the 10h family of high performance ecl logic. it consists of 4 translators with dif ferential inputs and ttl outputs. the 3 ? state outputs can be disabled by applying a high ttl logic level on the common oe input. the mc10h350 is designed to be used primarily in systems incorporating both ecl and ttl logic operating off a common power supply. the separate v cc power pins are not connected internally and thus isolate the noisy ttl v cc runs from the relatively quiet ecl v cc runs on the printed circuit board. the differential inputs allow the mc10h350 to be used as an inverting or noninverting translator, or a differential line receiver. the mc10h350 can also drive cmos with the addition of a pullup resistor. features ? propagation delay, 3.5 ns typical ? mecl 10k ? compatible ? pb ? free packages are available* *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. cdip ? 16 l suffix case 620a marking diagrams* pdip ? 16 p suffix case 648 http://onsemi.com *for additional marking information, refer to application note and8002/d. see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information soeiaj ? 16 case 966 16 1 16 1 mc10h350p awlyywwg 1 16 mc10h350l awlyyww a = assembly location wl, l = wafer lot yy, y = year ww, w = work week g= pb ? free package 10h350 alywg pllc ? 20 fn suffix case 775 20 1 10h350g awlyyww 120
mc10h350 http://onsemi.com 2 figure 1. logic diagram figure 2. dip pin assignment ecl v cc a out a in a in b in b in b out gnd ttl v cc c out c in c in d in d in d out oe 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 v cc (+5.0 vdc) = pins 1 and 16 gnd = pin 8 15 14 13 10 12 11 7 6 5 2 4 3 9 pin assignment is for dual ? in ? line package. table 1. maximum ratings symbol characteristic rating unit v cc power supply (v ee = gnd) 7.0 vdc t a operating temperature range 0 to +75 c t stg storage temperature range ? plastic ? ceramic ? 55 to +150 ? 55 to +165 c c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual str ess limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation i s not implied, damage may occur and reliability may be affected.
mc10h350 http://onsemi.com 3 table 2. electrical characteristics (v cc = 5.0 v 5%) (note 1) t a = 0 c to 75 c symbol characteristic min max unit i cc power supply current ttl ecl ? ? 20 12 ma i ih i inh input current high pin 9 others ? ? 20 50 a i il i inl input current low pin 9 others ? ? ? 0.6 50 ma a v ih input voltage high pin 9 2.0 ? vdc v il input voltage low pin 9 ? 0.8 vdc v diff differential input voltage (note 1) pins 3 ? 6, 11 ? 14 (1) 350 ? mv v cm voltage common mode pins 3 ? 6, 11 ? 14 2.8 v cc vdc v oh output voltage high i oh = 3.0 ma 2.7 ? vdc v ol output voltage low i ol = 20 ma ? 0.5 vdc i os short circuit current v out = 0 v ? 60 ? 150 ma i ozh output disable current high v out = 2.7 v ? 50 a i ozl output disable current low v out = 0.5 v ? ? 50 a *positive emitter coupled logic 1. common mode input voltage to pins 3 ? 4, 5 ? 6, 11 ? 12, 13 ? 14 must be between the values of 2.8 v and 5.0 v. this common mode input voltage range includes the differential input swing. 2. for single ? ended use, apply 3.75 v (v bb ) to either input depending on output polarity required. signal level range to other input is 3.3 v to 4.2 v. 3. any unused gates should have the inverting inputs tied to v cc and the noninverting inputs tied to ground to prevent output glitching. table 3. ac parameters (c l = 50 pf) (v cc = 5.0 5%) (t a = 0 c to 75 c) t a = 0 c to 75 c symbol characteristic min max unit t pd propagation delay data (50% to 1.5 v) 1.5 5.0 ns t r rise time (note 4) 0.3 1.6 ns t f fall time (note 4) 0.3 1.6 ns t pdlz t pdhz output disable time 2.0 2.0 6.0 6.0 ns t pdzl t pdzh output enable time 2.0 2.0 8.0 8.0 ns note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. 1.0 v to 2.0 v w/50 pf into 500 .
mc10h350 http://onsemi.com 4 t pzl 0.3 v oe 1.5 v 1.5 v 1.5 v t pzh t phz 3?state output high enable and disable times oe v out 0.3 v v ol 1.5 v 1.5 v 1.5 v t plz v oh 3.5 v +7.0 v open all other t pzl , t plz , o, c, 500 500 d.u.t . 50 pf figure 3. 3 ? state switching waveforms 3?state output low enable and disable times figure 4. test load *includes jig and probe capacitance v out application note: pin 9 is an oe and the mc10h350 is disabled when oe is at v ih or higher. ordering information device package shipping ? mc10h350fn pllc ? 20 46 units / rail mc10h350fng pllc ? 20 (pb ? free) 46 units / rail mc10h350fnr2 pllc ? 20 500 / tape & reel mc10h350fnr2g pllc ? 20 (pb ? free) 500 / tape & reel mc10h350l cdip ? 16 25 unit / rail mc10h350m soeiaj ? 16 50 unit / rail mc10h350mg soeiaj ? 16 (pb ? free) 50 unit / rail mc10h350mel soeiaj ? 16 2000 / tape & reel MC10H350MELG soeiaj ? 16 (pb ? free) 2000 / tape & reel mc10h350p pdip ? 16 25 unit / rail mc10h350pg pdip ? 16 (pb ? free) 25 unit / rail ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mc10h350 http://onsemi.com 5 package dimensions ? m ? ? n ? ? l ? y brk w v d d s l?m m 0.007 (0.180) n s t s l?m m 0.007 (0.180) n s t s l?m s 0.010 (0.250) n s t x g1 b u z view d ? d 20 1 s l?m m 0.007 (0.180) n s t s l?m m 0.007 (0.180) n s t s l?m s 0.010 (0.250) n s t c g view s e j r z a 0.004 (0.100) ? t ? seating plane s l?m m 0.007 (0.180) n s t s l?m m 0.007 (0.180) n s t h view s k k1 f g1 20 lead pllc case 775 ? 02 issue e notes: 1. dimensions and tolerancing per ansi y14.5m, 1982. 2. dimensions in inches. 3. datums ? l ? , ? m ? , and ? n ? determined where top of lead shoulder exits plastic body at mold parting line. 4. dimension g1, true position to be measured at datum ? t ? , seating plane. 5. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.250) per side. 6. dimensions in the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). dim min max min max millimeters inches a 0.385 0.395 9.78 10.03 b 0.385 0.395 9.78 10.03 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 ??? 0.51 ??? k 0.025 ??? 0.64 ??? r 0.350 0.356 8.89 9.04 u 0.350 0.356 8.89 9.04 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y ??? 0.020 ??? 0.50 z 2 10 2 10 g1 0.310 0.330 7.88 8.38 k1 0.040 ??? 1.02 ???
mc10h350 http://onsemi.com 6 package dimensions soeiaj ? 16 case 966 ? 01 issue a h e a 1 dim min max min max inches ??? 2.05 ??? 0.081 millimeters 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.10 0.20 0.007 0.011 9.90 10.50 0.390 0.413 5.10 5.45 0.201 0.215 1.27 bsc 0.050 bsc 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0 0.70 0.90 0.028 0.035 ??? 0.78 ??? 0.031 a 1 h e q 1 l e 10 0 10 l e q 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions d and e do not include mold flash or protrusions and are measured at the parting line. mold flash or protrusions shall not exceed 0.15 (0.006) per side. 4. terminal numbers are shown for reference only. 5. the lead width dimension (b) does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the lead width dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. minimum space between protrusions and adjacent lead to be 0.46 ( 0.018). m l detail p view p c a b e m 0.13 (0.005) 0.10 (0.004) 1 16 9 8 d z e a b c d e e l m z cdip ? 16 l suffix ceramic dip package case 620a ? 01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimension f may narrow to 0.76 (0.030) where the lead enters the ceramic body. 5 this drawing replaces obsolete case outline 620?10. f e n k c seating plane a m 0.25 (0.010) t m l dim min max min max millimeters inches a 0.750 0.785 19.05 19.93 b 0.240 0.295 6.10 7.49 c ??? 0.200 ??? 5.08 d 0.015 0.020 0.39 0.50 e 0.050 bsc 1.27 bsc f 0.055 0.065 1.40 1.65 g 0.100 bsc 2.54 bsc h 0.008 0.015 0.21 0.38 k 0.125 0.170 3.18 4.31 l 0.300 bsc 7.62 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.01 a b a b 16 1 9 8 g 16x d b m 0.25 (0.010) t t 16x j
mc10h350 http://onsemi.com 7 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. ? a ? b f c s h g d j l m 16 pl seating 18 9 16 k plane ? t ? m a m 0.25 (0.010) t dim min max min max millimeters inches a 0.740 0.770 18.80 19.55 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.040 0.70 1.02 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.110 0.130 2.80 3.30 l 0.295 0.305 7.50 7.74 m 0 10 0 10 s 0.020 0.040 0.51 1.01 pdip ? 16 p suffix plastic dip package case 648 ? 08 issue r on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2 ? 9 ? 1 kamimeguro, meguro ? ku, tokyo, japan 153 ? 0051 phone : 81 ? 3 ? 5773 ? 3850 mc10h350/d mecl 10k is a trademark of motorola, inc. literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082 ? 1312 usa phone : 480 ? 829 ? 7710 or 800 ? 344 ? 3860 toll free usa/canada fax : 480 ? 829 ? 7709 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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